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                      En

                      • 晶圆级封装

                      • 系统级封装

                      • 倒装

                      • 基板封装

                      • 引线框封装

                      • 分立器件

                      Fan-in (Wafer Level Package)

                      • WLCSP

                      • eWLCSP

                      Fan-out (Wafer Level Package)

                      • eWLB 300mm / HD 330mm (2D, 2.5D, 3D)

                      Integrated Passive Devices

                      • IPD

                      Through Silicon Via

                      • TSV for CIS

                      • TSV for rocessor (in development)

                      System-in-Package

                      • FOWLP SiP

                      • Laminate FC SiP

                      • Laminate FC + WB SiP

                      • SiP Modules

                      • Leadframe WB SiP

                      • Laminate Stack Die WB SiP

                      Flip Chip Packages

                      • fcFBGA

                      • fcBGA

                      • fcCuBE

                      • Bare die fcPoP

                      • Molded Laser fcPoP

                      • Flip Chip on Leadframe (FCOL)

                      • Molded Interconnect System (MIS)

                      Substrate Packages

                      • PBGA

                      • FBGA (Stacked Die)

                      • Package-on-Package

                      • MEMS

                      • LGA

                      • Smart Card

                      Lead Frame Packages

                      • QFN

                      • DFN

                      • QFP

                      • SOT

                      • SOP

                      • DIP

                      • Molded Interconnect System (MIS)

                      Discrete Packages

                      • TO

                      • SOD

                      • SOT

                      • FBP

                      • DFN

                      • SOP

                      Discrete Products

                      • Diodes

                      • MOSFET

                      • Transistors

                      • Rectifier

                      • BRT

                      • TRIACS

                      • TVS

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                      联系我们 客户查询 法律声明

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                      版权所有@江苏长电科技股份有限公司
                      保留一切权利
                      苏ICP备05082751号 32028102000607

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